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Last edited by RenameBot
August 29, 2008 | History
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John H. Lau

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25 works Add another?

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  • Cover of: Electronic Packaging: Design, Materials, Process, and Reliability

    First published in 1998 3 editions in 1 language
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  • Cover of: Solder joint reliability: theory and applications

    First published in 1991 3 editions in 1 language
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  • Cover of: Electronics manufacturing: with lead-free, halogen-free, and conductive-adhesive materials

    First published in 2002 3 editions in 1 language — 1 previewable
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  • Cover of: Fan-Out Wafer-Level Packaging

    First published in 2018 3 editions in 1 language
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  • Cover of: Semiconductor Advanced Packaging

    First published in 2021 3 editions in 1 language
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  • Cover of: Assembly and Reliability of Lead-Free Solder Joints

    First published in 2020 2 editions in 1 language
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  • Cover of: The Mechanics of solder alloy interconnects

    First published in 1993 2 editions in 1 language — 1 previewable
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  • Cover of: Microvias: For Low Cost, High Density Interconnects

    First published in 2001 2 editions in 1 language — 1 previewable
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  • Cover of: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

    First published in 2000 2 editions in 1 language — 1 previewable
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  • Cover of: Chip Scale Package: Design, Materials, Process, Reliability, and Applications

    First published in 1999 2 editions in 1 language — 1 previewable
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  • Cover of: Heterogeneous Integrations

    First published in 2019 2 editions in 1 language
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  • Cover of: Chiplet Design and Heterogeneous Integration Packaging

    First published in 2023 2 editions in 1 language
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  • Cover of: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

    First published in 2024 1 edition in 1 language
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  • Cover of: Handbook of fine pitch surface mount technology

    First published in 1994 1 edition in 1 language — 1 previewable
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  • Cover of: Advanced MEMS packaging

    First published in 2010 1 edition in 1 language — 1 previewable
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  • Cover of: Chip on board technologies for multichip modules

    First published in 1994 1 edition in 1 language — 1 previewable
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  • Cover of: Handbook of tape automated bonding

    First published in 1992 1 edition in 1 language
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  • Cover of: Reliability Of Rohscompliant 2d And 3d Ic Interconnects

    First published in 2010 1 edition — 1 previewable
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  • Cover of: Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

    First published in 1994 1 edition in 1 language
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  • Cover of: Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)

    First published in 1993 1 edition in 1 language
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We need a photo of John H. Lau

Subjects
Electronic packaging, Microelectronic packaging, Design and construction, Integrated circuits, Multichip modules (Microelectronics), Solder and soldering, Electric circuits, Flip chip technology, Reliability, Surface mount technology, Ball grid array technology, Chip scale packaging, Cost control, Electric engineering, Electronic apparatus and appliances, Electronics, materials, Environmental protection, Fine pitch technology, Green electronics, Green products, Green technology, Interconnected electric utility systems, Interconnects (Integrated circuit technology), Junctions, Manufactures

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ID Numbers

  • OLID: OL537852A

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History

Download catalog record: RDF / JSON
August 29, 2008 Edited by RenameBot fix author name
April 1, 2008 Created by an anonymous user initial import