An edition of Mems Packaging (Emis Processing) (2003)

Mems Packaging (Emis Processing)

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Cover of: Mems Packaging (Emis Processing) by Tai-Ran Hsu, Tai-Ran Hsu
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Last edited by Open Library Bot
April 24, 2010 | History
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An edition of Mems Packaging (Emis Processing) (2003)

Mems Packaging (Emis Processing)

by

  • 1 Want to read

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Publish Date
Publisher
Institution of Electrical Engineers
Language
English
Pages
272

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Edition Availability
Cover of: Mems Packaging (Emis Processing)
Mems Packaging (Emis Processing)
December 2003, Institution of Electrical Engineers
Hardcover in English
Cover of: MEMS PACKAGING; ED. BY TAI-RAN HSU.
MEMS PACKAGING; ED. BY TAI-RAN HSU.
Publish date unknown, INST OF ELEC ENGINEERS
in Undetermined

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Book Details

First Sentence

"This chapter intends to set the tone for several subsequent chapters in the book."

The Physical Object

Format
Hardcover
Number of pages
272
Dimensions
9.8 x 7.3 x 0.9 inches
Weight
1.6 pounds

Edition Identifiers

Open Library
OL8312548M
ISBN 10
0863413358
ISBN 13
9780863413353
Goodreads
5254918

Work Identifiers

Work ID
OL4478444W

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
April 24, 2010 Edited by Open Library Bot Fixed duplicate goodreads IDs.
April 16, 2010 Edited by bgimpertBot Added goodreads ID.
April 14, 2010 Edited by Open Library Bot Linked existing covers to the edition.
December 15, 2009 Edited by WorkBot link works
April 29, 2008 Created by an anonymous user Imported from amazon.com record