MARC Record from marc_columbia

LEADER: 03674mam a2200409 a 4500
001 1548886
005 20220608185001.0
008 930212t19931993nyu b 000 0 eng
010 $a 93009709
020 $a0471594369 (alk. paper) :$c$69.95
035 $a(OCoLC)ocm27728002
035 $9AKD1483CU
035 $a1548886
040 $aDLC$cDLC$dNNC
050 00 $aTK7870.15$b.Q35 1993
082 00 $a621.381/046$220
245 00 $aQuality conformance and qualification of microelectronic packages and interconnects /$ceditors, Michael Pecht [and others].
260 $aNew York :$bWiley,$c[1993], ©1993.
263 $a9310
300 $axxxiii, 461 pages :$billustrations ;$c25 cm
336 $atext$btxt$2rdacontent
337 $aunmediated$bn$2rdamedia
500 $a"A Wiley-Interscience publication."
504 $aIncludes bibliographical references (p. 419-450) and index.
505 0 $a1. Introduction -- 2. Three-dimensional Stacked Dies -- 3. Cofired Ceramic Substrates -- 4. Organic Laminated Substrates and Chip-on-board -- 5. High-density Interconnects and Deposited Dielectrics -- 6. Wire and Wirebonds -- 7. Tape Automated Bonds -- 8. Flip-chip Bonds -- 9. Device and Substrate Attachment -- 10. Cases -- 11. Leads -- 12. Lead Seals -- 13. Lid Seals -- 14. Material and Product Evaluation Methods -- 15. Rework Methods.
520 $aAll packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product.
520 8 $aIt has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, quality screens, and tests.
520 8 $aThis book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics.
520 8 $aIt does this with powerful techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data; physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product; and process controls that decrease variabilities in the end product and reduce end-of-line screening and testing.
520 8 $aA wide range of microelectronic package and interconnect configurations for both single- and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail.
520 8 $aThe product of a distinguished team of authors and editors, this book's guidelines for avoiding potential high-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals.
650 0 $aElectronic packaging$xDefects.
650 0 $aElectronic packaging$xQuality control.
650 0 $aElectronic packaging$xTesting.
650 0 $aQuality assurance.$0http://id.loc.gov/authorities/subjects/sh85109438
700 1 $aPecht, Michael.$0http://id.loc.gov/authorities/names/no90006088
852 00 $boff,eng$hTK7870.15$i.Q35 1994