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All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product.
It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, quality screens, and tests.
This book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics.
It does this with powerful techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data; physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product; and process controls that decrease variabilities in the end product and reduce end-of-line screening and testing.
A wide range of microelectronic package and interconnect configurations for both single- and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail.
The product of a distinguished team of authors and editors, this book's guidelines for avoiding potential high-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals.
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Subjects
Electronic packaging, Quality assurance, Defects, Quality control, TestingShowing 1 featured edition. View all 1 editions?
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1
Quality conformance and qualification of microelectronic packages and interconnects
1994, Wiley
in English
0471594369 9780471594369
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Edition Notes
Includes bibliographical references (p. 419-450) and index.
"A Wiley-Interscience publication."
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- Created April 1, 2008
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July 15, 2024 | Edited by MARC Bot | import existing book |
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April 1, 2008 | Created by an anonymous user | Imported from Scriblio MARC record |