| Record ID | marc_columbia/Columbia-extract-20221130-007.mrc:238819556:1369 |
| Source | marc_columbia |
| Download Link | /show-records/marc_columbia/Columbia-extract-20221130-007.mrc:238819556:1369?format=raw |
LEADER: 01369mam a22003374a 4500
001 3236848
005 20221020013946.0
008 010425t20022002maua b 001 0 eng
010 $a 2001031713
020 $a0750672188 (alk. paper)
035 $a(OCoLC)123123425
035 $a(OCoLC)ocn123123425
035 $9AUK9876CU
035 $a(NNC)3236848
035 $a3236848
040 $aDLC$cDLC$dC#P
042 $apcc
050 00 $aTK7836$b.L43 2002
082 00 $a621.381/046$221
100 1 $aLee, Ning-Cheng.$0http://id.loc.gov/authorities/names/n2001005642
245 10 $aReflow soldering processes and troubleshooting :$bSMT, BGA, CSP, and flip chip technologies /$cNing-Cheng Lee.
260 $aBoston :$bNewnes,$c[2002], ©2002.
300 $a1 volume (various pagings) :$billustrations ;$c26 cm
336 $atext$btxt$2rdacontent
337 $aunmediated$bn$2rdamedia
504 $aIncludes bibliographical references and index.
650 0 $aElectronic apparatus and appliances$xDesign and construction.$0http://id.loc.gov/authorities/subjects/sh85042256
650 0 $aSolder and soldering.$0http://id.loc.gov/authorities/subjects/sh85124553
650 0 $aElectronic packaging.$0http://id.loc.gov/authorities/subjects/sh85042366
650 0 $aElectric connectors.$0http://id.loc.gov/authorities/subjects/sh85041625
852 00 $boff,eng$hTK7836$i.L43 2002