An edition of Reflow soldering processes and troubleshooting
(2002)
Reflow soldering processes and troubleshooting
SMT, BGA, CSP and flip chip technologies
by Ning-Cheng Lee
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Design and construction, Electric connectors, Electronic apparatus and appliances, Electronic packaging, Solder and soldering, TECHNOLOGY & ENGINEERING, Microelectronics, Digital, Electronics, Integrated circuits, Manufacturing, Industrial technology, General, Chemical & biochemical, Professional, career & trade -> electronics -> general, Trades & technology -> industrial technology -> manufacturing, Trades & technology -> industrial technology -> industrial technology, Professional, career & trade -> engineering -> chemical engineeringShowing 1 featured edition. View all 1 editions?
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Reflow soldering processes and troubleshooting: SMT, BGA, CSP and flip chip technologies
2002, Newnes
in English
0750672188 9780750672184
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Includes bibliographical references and index.
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- Created August 29, 2008
- 13 revisions
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| September 7, 2024 | Edited by MARC Bot | import existing book |
| December 19, 2023 | Edited by ImportBot | import existing book |
| November 14, 2023 | Edited by MARC Bot | import existing book |
| December 3, 2020 | Edited by MARC Bot | import existing book |
| August 29, 2008 | Created by ImportBot | Imported from Western Washington University MARC record |