| Record ID | marc_columbia/Columbia-extract-20221130-026.mrc:97851458:4131 |
| Source | marc_columbia |
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LEADER: 04131cam a2200661Ia 4500
001 12871833
005 20220611224242.0
006 m o d
007 cr cn|||||||||
008 041025s2004 nyua ob 001 0 eng d
010 $a 2003018016
035 $a(OCoLC)ocm56811636
035 $a(NNC)12871833
040 $aKNOVL$beng$epn$cKNOVL$dOCLCQ$dDEBSZ$dOCLCQ$dDEBBG$dOCLCQ$dKNOVL$dZCU$dOCLCF$dKNOVL$dOCLCO$dKNOVL$dOCLCQ$dOPELS$dN$T$dIDEBK$dE7B$dYDXCP$dMERUC$dOCLCQ$dCOO$dCEF$dEBLCP$dB24X7$dUKDOC$dOCLCQ$dVT2$dUAB$dOCLCQ$dBUF$dREB$dD6H$dRRP$dAU@$dWYU$dYOU$dOCLCQ$dLEAUB$dS9I$dOCLCQ$dUWW$dOCLCO
019 $a281606761$a303538887$a468767278$a476274946$a647803274$a742293949$a765133981$a815766811$a823120489$a961882975$a988678439$a999554827$a1058001869$a1058047301$a1065940209$a1086872546
020 $a0815514832$q(electronic bk.)
020 $a9780815514831$q(electronic bk.)
020 $a9783540211181
020 $a3540211187
020 $a9780815519317$q(electronic bk.)
020 $a0815519311$q(electronic bk.)
020 $a1282027662
020 $a9781282027664
024 3 $a9780815514831
035 $a(OCoLC)56811636$z(OCoLC)281606761$z(OCoLC)303538887$z(OCoLC)468767278$z(OCoLC)476274946$z(OCoLC)647803274$z(OCoLC)742293949$z(OCoLC)765133981$z(OCoLC)815766811$z(OCoLC)823120489$z(OCoLC)961882975$z(OCoLC)988678439$z(OCoLC)999554827$z(OCoLC)1058001869$z(OCoLC)1058047301$z(OCoLC)1065940209$z(OCoLC)1086872546
037 $bKnovel Corporation$nhttp://www.knovel.com
050 4 $aTS695$b.W38 2004eb
072 7 $aTEC$x008100$2bisacsh
072 7 $aTEC$x008090$2bisacsh
072 7 $aTGB$2bicssc
082 04 $a621.3815/2$222
049 $aZCUA
100 1 $aWasa, Kiyotaka.
245 10 $aThin film materials technology :$bsputtering of compound materials /$cby Kiyotaka Wasa, Makoto Kitabatake, Hideaki Adachi.
260 $aNorwich, NY :$bWilliam Andrew Pub. ;$aHeidelberg :$bSpringer,$c©2004.
300 $a1 online resource (xiv, 518 pages) :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
504 $aIncludes bibliographical references and index.
588 0 $aPrint version record.
505 0 $aThin Film Materials and Devices -- Thin Film Process -- Sputtering Phenomena -- Sputtering Systems -- Deposition of Compound Thin Films -- Structural Control of Compound Thin Films -- Microfabrication by Sputtering -- Appendices -- Index.
520 $aAn invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, a key technology for nano-materials in high-speed information applications and large-area functional coating such as automotive or decorative painting of plastic parts, among other topics. In seven concise chapters, the book thoroughly reviews basic thin film technology and deposition processes, sputtering processes, structural control of compound thin films, and microfabrication by sputtering.
650 0 $aCathode sputtering (Plating process)
650 0 $aThin films.
650 6 $aPulvérisation cathodique$xApplications industrielles.
650 6 $aCouches minces.
650 7 $aTECHNOLOGY & ENGINEERING$xElectronics$xSolid State.$2bisacsh
650 7 $aTECHNOLOGY & ENGINEERING$xElectronics$xSemiconductors.$2bisacsh
650 7 $aCathode sputtering (Plating process)$2fast$0(OCoLC)fst00849113
650 7 $aThin films.$2fast$0(OCoLC)fst01150018
655 0 $aElectronic books.
655 4 $aElectronic books.
700 1 $aKitabatake, Makoto.
700 1 $aAdachi, Hideaki.
776 08 $iPrint version:$aWasa, Kiyotaka.$tThin film materials technology.$dNorwich, NY : William Andrew Pub. ; Heidelberg : Springer, ©2004$z0815514832$w(DLC) 2003018016$w(OCoLC)52886812
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio12871833$zACADEMIC - Electronics & Semiconductors
852 8 $blweb$hEBOOKS