| Record ID | marc_loc_2016/BooksAll.2016.part22.utf8:156201821:1198 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part22.utf8:156201821:1198?format=raw |
LEADER: 01198pam a2200289 a 4500
001 93009709
003 DLC
005 20040618093805.0
008 930212s1994 nyua b 001 0 eng
010 $a 93009709
020 $a0471594369 (alk. paper) :$c$69.95
040 $aDLC$cDLC$dDLC
050 00 $aTK7870.15$b.Q35 1994
082 00 $a621.381/046$220
245 00 $aQuality conformance and qualification of microelectronic packages and interconnects /$cedited by Michael Pecht ... [et al.].
260 $aNew York :$bWiley,$cc1994.
300 $axxxiii, 461 p. :$bill. ;$c25 cm.
500 $a"A Wiley-Interscience publication."
504 $aIncludes bibliographical references (p. 419-450) and index.
650 0 $aElectronic packaging$xDefects.
650 0 $aElectronic packaging$xQuality control.
650 0 $aElectronic packaging$xTesting.
650 0 $aQuality assurance.
700 1 $aPecht, Michael.
856 42 $3Contributor biographical information$uhttp://www.loc.gov/catdir/bios/wiley041/93009709.html
856 42 $3Publisher description$uhttp://www.loc.gov/catdir/description/wiley032/93009709.html
856 4 $3Table of Contents$uhttp://www.loc.gov/catdir/toc/onix03/93009709.html