An edition of MEMS packaging (2004)

MEMS packaging

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Cover of: MEMS packaging by Tai-Ran Hsu
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Last edited by MARC Bot
December 21, 2022 | History
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An edition of MEMS packaging (2004)

MEMS packaging

by

  • 1 Want to read

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Publish Date
Publisher
INSPEC
Language
English
Pages
275

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Subjects

Microelectromechanical systems, Microelectronic packaging, Microsystèmes électromécaniques, Mise sous boîtier (Microélectronique), Bauelement, Mikroelektronik, Mikromechanik
Edition Availability
Cover of: MEMS packaging
MEMS packaging
2004, INSPEC
electronic resource / in English
Cover of: MEMS Packaging
MEMS Packaging
2004, Institution of Engineering & Technology
in English
Cover of: MEMS packaging
MEMS packaging
2004, INSPEC
in English

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Book Details

Edition Notes

Includes bibliographical references and index.

Published in
London
Series
EMIS processing series -- no. 3.

Classifications

Dewey Decimal Class
621.381
Library of Congress
TK7875 .M4576 2004, TK7874 .M46 2004eb

The Physical Object

Pagination
xxix, 275 p. :
Number of pages
275

ID Numbers

Open Library
OL18986353M
ISBN 10
0863413358
LCCN
2014415226
OCLC/WorldCat
53030765, 692197050
Goodreads
5254918

Source records

Oregon Libraries MARC record
University of Toronto MARC record
Library of Congress MARC record
marc_columbia MARC record

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History

Download catalog record: RDF / JSON
December 21, 2022 Edited by MARC Bot import existing book
February 7, 2019 Created by MARC Bot import existing book