An edition of Semiconductor machining at the micro-nano scale
(2007)
Semiconductor machining at the micro-nano scale
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1
Semiconductor machining at the micro-nano scale
2007, Transworld Research Network
in English
8178953013 9788178953014
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Semiconductor machining at the micro-nano scale
2007, Transworld Research Network
in English
8178953013 9788178953014
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Book Details
Table of Contents
Part 1/ SINGLE- POINT MACHINING PROCESSES: Surface and subsurface integrity in ductile machining of semiconductor materials/ Jiwang Yan
Numerical simulations and cutting experiments on single point diamond machining of semiconductors and ceramics / John A. Patten, Jerry Jacob, Biswarup Bhattacharya, Andrew Grevstad, Ning Fang and Eric R. Marsh
Ductile machining and high pressure phase transformations of semiconductor crystals / Renato Goulart Jasinevicius, Jaime Gilberto Duduch and Paulo Sergio Pizani.
Part 2/ CHARACTERIZATION OF DEFORMATION MECHANISMS: Microstructural cahnges in silicon caused by indentation and machining / L. C. Zhang
MD simulation of semiconductor micromachining / Hiroaki Tanaka and Shoichi Shimada.
Part 3/ ABRASIVE MACHINING PROCESSES: Grinding of silicon wafers in the nano-technology era / Z.J. Pei, Z. C. Li and G. R. Fisher
Single-crystalline and poly-crystalline silicon wafer production using slurry wire for wafer slicing with micro-and nano-scale rolling-indenting / Sumeet Bhagavat and Imin Kao
Tribo-metrology of CMP / Norm V. Gitts
Part 4/ HYBRID AND LASER MACHINING: Semiconductor nanofabrication by combining nanoscale machining with wet etching / Noboiru Morita and Noritaka Kawasegi
Laser machining of semiconductor devices / Maher S. Amer.
Edition Notes
Includes bibliographical references and index.
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| February 9, 2019 | Created by MARC Bot | import existing book |