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Previews available in: English
Edition | Availability |
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1
Low Dielectric Constant Materials for IC Applications
December 16, 2002, Springer
Hardcover
in English
- 1 edition
3540678190 9783540678199
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Book Details
First Sentence
"As integrated circuit dimensions continue to decrease, RC delay, crosstalk noise and power dissipation of the interconnect structure become limiting factors for ultra-large-scale integration of integrated circuits."
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Feedback?February 10, 2019 | Created by MARC Bot | import existing book |