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Last edited anonymously
April 29, 2008 | History
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P. S. Ho

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11 works Add another?

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  • Cover of: Advanced interconnects for ULSI technology

    First published in 2012 — 6 editions
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  • Cover of: Submicron multiphase materials: symposium held April 28-30, 1992, San Francisco, California, U.S.A.

    First published in 1992 — 4 editions
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  • Cover of: Thin films: interfaces and phenomena : symposium held December 2-6, 1985, Boston, Massachusetts, USA

    First published in 1986 — 2 editions
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  • Cover of: Stress-Induced Phenomena in Metallization: Third International Workshop (AIP Conference Proceedings, No. 373)

    First published in 1996 — 2 editions
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  • Cover of: Stress-induced Phenomena in Metallization: Proceedings of the Second International Workshop held in Austin, Texas, March 1993 (AIP Conference Proceedings ... Phenomena Metallizat.)

    First published in 1994 — 2 editions
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  • Cover of: Low Dielectric Constant Materials for IC Applications

    First published in 2002 — 1 edition
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  • Cover of: Thin Films Vol. 54: Interfaces and Phenomena

    First published in 2014 — 1 edition
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  • Cover of: Stress induced phenomena in metallization: fourth international workshop, Tokyo, Japan, June, 1997

    First published in 1998 — 1 edition
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  • Cover of: Materials Reliability Issues in Microelectronics (Materials Research Society Symposium Proceedings)

    First published in 1991 — 1 edition
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  • Cover of: Stress-induced phenomena in metallization: first international workshop, Ithaca, NY, 1991

    First published in 1992 — 1 edition
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  • Cover of: Diffusion phenomena in thin films and microelectronic materials

    First published in 1988 — 1 edition
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Subjects

Congresses, Aluminum films, Defects, Metallic films, Semiconductors, Thin film devices, Integrated circuits, Microstructure, Thin films, Electrodiffusion, Materials, Surface chemistry, Acoustic surface wave devices, Composite materials, Crystallography, Dielectrics, Diffusion, Electric insulators and insulation, Electrochemical metallizing, Electronic packaging, Integrated circuits, ultra large scale integration, Interconnects (Integrated circuit technology), Layer structure (Solids), Liquid crystal devices, Materials, research

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ID Numbers

  • OLID: OL2949994A

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History

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April 29, 2008 Created by an anonymous user initial import