Materials, integration and packaging issues for high-frequency devices

symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.

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Last edited by ImportBot
August 1, 2020 | History

Materials, integration and packaging issues for high-frequency devices

symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.

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Publish Date
Language
English
Pages
232

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Edition Availability
Cover of: Materials, integration and packaging issues for high-frequency devices

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Book Details


Edition Notes

Includes bibliographical references and indexes.
"This volume is a collection of half of the papers given at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issues for High-Frequency Devices,' held December 1-3 at the 2003 MRS Fall Meeting in Boston, Massachusetts."--P. xi.

Published in
Warrendale, Pa
Series
Materials Research Society symposium proceedings ;, v. 783, Materials Research Society symposia proceedings ;, v. 783.
Genre
Congresses.

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7870.15 .M384 2004

The Physical Object

Pagination
xiii, 232 p. :
Number of pages
232

ID Numbers

Open Library
OL3327429M
ISBN 10
1558997210
LCCN
2004301726
OCLC/WorldCat
55227731

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August 1, 2020 Edited by ImportBot import existing book
February 18, 2019 Created by MARC Bot import existing book