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Subjects
Congresses, Electronic packagingEdition | Availability |
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Book Details
Edition Notes
Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology.
Classifications
The Physical Object
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Feedback?October 18, 2022 | Edited by ImportBot | import existing book |
February 19, 2019 | Created by MARC Bot | import existing book |