An edition of Advanced Manufacturing Processes, Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging (2006)

Advanced Manufacturing Processes, Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging

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Advanced Manufacturing Processes, Lead Free I ...
C. Bailey, Johan Liu, C. Baile ...
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Last edited by ImportBot
January 30, 2024 | History
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An edition of Advanced Manufacturing Processes, Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging (2006)

Advanced Manufacturing Processes, Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging

by and

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Publish Date
Publisher
Emerald Publishing Limited
Language
English

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Edition Availability
Cover of: Advanced Manufacturing Processes, Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging
Advanced Manufacturing Processes, Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging
2006, Emerald Publishing Limited
in English

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Book Details

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Library of Congress
TK7870.15.A28 2006

ID Numbers

Open Library
OL50568709M
ISBN 13
9781846630118

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January 30, 2024 Created by ImportBot import new book