An edition of Mems Packaging (Emis Processing) (2003)

Mems Packaging (Emis Processing)

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Cover of: Mems Packaging (Emis Processing) by Tai-Ran Hsu, Tai-Ran Hsu
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Last edited by Open Library Bot
April 28, 2010 | History
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An edition of Mems Packaging (Emis Processing) (2003)

Mems Packaging (Emis Processing)

by

  • 1 Want to read

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Publish Date
Publisher
Institution of Electrical Engineers
Language
English
Pages
272

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Edition Availability
Cover of: Mems Packaging (Emis Processing)
Mems Packaging (Emis Processing)
December 2003, Institution of Electrical Engineers
Hardcover in English
Cover of: MEMS PACKAGING; ED. BY TAI-RAN HSU.
MEMS PACKAGING; ED. BY TAI-RAN HSU.
Publish date unknown, INST OF ELEC ENGINEERS
in Undetermined

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Book Details

First Sentence

"This chapter intends to set the tone for several subsequent chapters in the book."

The Physical Object

Format
Hardcover
Number of pages
272
Dimensions
9.8 x 7.3 x 0.9 inches
Weight
1.6 pounds

Edition Identifiers

Open Library
OL8312548M
ISBN 10
0863413358
ISBN 13
9780863413353
Goodreads
5254918

Work Identifiers

Work ID
OL4478444W

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History

Download catalog record: RDF / JSON
April 28, 2010 Edited by Open Library Bot Linked existing covers to the work.
December 10, 2009 Created by WorkBot add works page