Mechanical design of electronic sytems

Mechanical design of electronic sytems
James W. Dally, James W. Dally
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Last edited by MARC Bot
December 20, 2020 | History

Mechanical design of electronic sytems

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Publish Date
Language
English
Pages
648

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Edition Availability
Cover of: Mechanical design of electronic sytems
Mechanical design of electronic sytems
2008, College House Enterprises
in English
Cover of: Enes100 Supplement Anti-Icing Systems for Highway Bridges
Enes100 Supplement Anti-Icing Systems for Highway Bridges
2005, College House Enterprises
Paperback - First edition

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Book Details


Table of Contents

Electronic components and semiconductors services.
Circuit analysis.
First level packaging: the chip carrier.
Second level packaging: substrates and printed circuit boards.
Production of printed circuit boards.
Electronics manufacturing: chip carrier to substrate.
Third level packaging: connectors, cables, modules, card cages and cabinet.
Thermal analysis methods: conduction.
Thermal analysis methods: radiation and convection.
Stress and failure: analysis of mechanical components.
Thermo-mechanical analysis.
Analysis of vibration of electronic equipment.
Theory of reliability.
Design to improve reliability.

Edition Notes

Includes bibliographic references and index.

Published in
Knoxville, Tenn

Classifications

Library of Congress
TK7870.15 .D35 2008

The Physical Object

Pagination
xiv, 648 p. :
Number of pages
648

ID Numbers

Open Library
OL23150408M
ISBN 10
0976241331
ISBN 13
9780976241331
LCCN
2008274996
Goodreads
6680866

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History

Download catalog record: RDF / JSON
December 20, 2020 Edited by MARC Bot import existing book
December 9, 2009 Created by WorkBot add works page