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Last edited anonymously
April 29, 2008 | History
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Ning-Cheng Lee

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4 works Add another?

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  • Cover of: Electronics manufacturing: with lead-free, halogen-free, and conductive-adhesive materials

    First published in 2002 3 editions in 1 language — 1 previewable
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  • Cover of: Assembly and Reliability of Lead-Free Solder Joints

    First published in 2020 2 editions in 1 language
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  • Cover of: Reflow Soldering Processes

    First published in 2002 1 edition in 1 language
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  • Cover of: Reflow soldering processes and troubleshooting: SMT, BGA, CSP and flip chip technologies

    First published in 2002 1 edition in 1 language — 1 previewable
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We need a photo of Ning-Cheng Lee

Subjects
Design and construction, Electronic apparatus and appliances, Integrated circuits, Chemical & biochemical, Digital, Electric connectors, Electronic packaging, Electronics, Electronics, materials, Environmental protection, General, Green electronics, Green products, Industrial technology, Manufactures, Manufacturing, Microelectronics, Professional, career & trade -> electronics -> general, Professional, career & trade -> engineering -> chemical engineering, Solder and soldering, TECHNOLOGY & ENGINEERING, Trades & technology -> industrial technology -> industrial technology, Trades & technology -> industrial technology -> manufacturing

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ID Numbers

  • OLID: OL2636357A

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History

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April 29, 2008 Created by an anonymous user initial import