An edition of 3D Microelectronic Packaging (2016)

3D Microelectronic Packaging

From Fundamentals to Applications

by and

Cover of: 3D Microelectronic Packaging by Yan Li, Deepak Goyal, Yan Li, Deepak Goyal
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Last edited by ImportBot
April 30, 2020 | History
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An edition of 3D Microelectronic Packaging (2016)

3D Microelectronic Packaging

From Fundamentals to Applications

by and

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Publish Date
Publisher
Springer
Pages
472

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Subjects

Electronic packaging

Showing 5 featured editions. View all 5 editions?

Edition Availability
Cover of: 3D Microelectronic Packaging
3D Microelectronic Packaging: From Architectures to Applications
2021, Springer Singapore Pte. Limited
in English
Libraries near you: WorldCat
Cover of: 3D Microelectronic Packaging
3D Microelectronic Packaging: From Architectures to Applications
2020, Springer Singapore Pte. Limited
in English
Libraries near you: WorldCat
Cover of: 3D Microelectronic Packaging
3D Microelectronic Packaging: From Fundamentals to Applications
Jul 12, 2018, Springer
paperback
Libraries near you: WorldCat
Cover of: 3D Microelectronic Packaging
3D Microelectronic Packaging: From Fundamentals to Applications
Feb 01, 2017, Springer
hardcover
  • Not in Library
Libraries near you: WorldCat
Cover of: 3D Microelectronic Packaging
3D Microelectronic Packaging: From Fundamentals to Applications
2016, Springer
in English
Libraries near you: WorldCat

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Book Details

Edition Notes

Source title: 3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics (57))

The Physical Object

Format
hardcover
Number of pages
472

ID Numbers

Open Library
OL27976382M
ISBN 10
3319445847
ISBN 13
9783319445847

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amazon.com record

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April 30, 2020 Created by ImportBot Imported from amazon.com record