An edition of 3D Microelectronic Packaging (2016)

3D Microelectronic Packaging

From Fundamentals to Applications

Yan Li, Deepak Goyal

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March 1, 2022 | History

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An edition of 3D Microelectronic Packaging (2016)

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Publish Date

2016

Publisher

Springer

Language

English

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Edition	Availability
1 3D Microelectronic Packaging: From Architectures to Applications 2021, Springer Singapore Pte. Limited in English 9811570922 9789811570926	zzzz Not in Library Libraries near you: WorldCat
2 3D Microelectronic Packaging: From Architectures to Applications 2020, Springer Singapore Pte. Limited in English 9811570892 9789811570896	zzzz Not in Library Libraries near you: WorldCat
3 3D Microelectronic Packaging: From Fundamentals to Applications Jul 12, 2018, Springer paperback 3319830864 9783319830865	zzzz Not in Library Libraries near you: WorldCat
4 3D Microelectronic Packaging: From Fundamentals to Applications Feb 01, 2017, Springer hardcover 3319445847 9783319445847	zzzz Not in Library Libraries near you: WorldCat
5 3D Microelectronic Packaging: From Fundamentals to Applications 2016, Springer in English 3319445863 9783319445861	aaaa Not in Library Libraries near you: WorldCat