An edition of 3D Microelectronic Packaging
(2016)
3D Microelectronic Packaging
From Fundamentals to Applications
by Yan Li and Deepak Goyal
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Electronic packagingShowing 5 featured editions. View all 5 editions?
| Edition | Availability |
|---|---|
1
3D Microelectronic Packaging: From Architectures to Applications
2021, Springer Singapore Pte. Limited
in English
9811570922 9789811570926
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2
3D Microelectronic Packaging: From Architectures to Applications
2020, Springer Singapore Pte. Limited
in English
9811570892 9789811570896
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3
3D Microelectronic Packaging: From Fundamentals to Applications
Jul 12, 2018, Springer
paperback
3319830864 9783319830865
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4
3D Microelectronic Packaging: From Fundamentals to Applications
Feb 01, 2017, Springer
hardcover
3319445847 9783319445847
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5
3D Microelectronic Packaging: From Fundamentals to Applications
2016, Springer
in English
3319445863 9783319445861
|
zzzz
Libraries near you:
WorldCat
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Book Details
Edition Notes
Source title: 3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics)
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- Created June 8, 2020
- 2 revisions
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| February 28, 2022 | Edited by ImportBot | import existing book |
| June 8, 2020 | Created by ImportBot | Imported from amazon.com record |