An edition of Fan-Out Wafer-Level Packaging (2018)

Fan-Out Wafer-Level Packaging

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Fan-Out Wafer-Level Packaging
John H. Lau, John H. Lau
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Last edited by Scott365Bot
April 24, 2024 | History
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An edition of Fan-Out Wafer-Level Packaging (2018)

Fan-Out Wafer-Level Packaging

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Publish Date
Publisher
Springer
Language
Chinese
Pages
452

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Subjects

Electronic packaging

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Edition Availability
Cover of: Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
2018, Springer
in Chinese
  • Not in Library
Libraries near you: WorldCat
Cover of: Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Dec 16, 2018, Springer
paperback
Libraries near you: WorldCat
Cover of: Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Apr 13, 2018, Springer
hardcover
Libraries near you: WorldCat

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Book Details

ID Numbers

Open Library
OL51664992M
ISBN 10
9811088845
ISBN 13
9789811088841
OpenAlex
W2795549950

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ISBNdb
OpenAlex

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April 24, 2024 Created by Scott365Bot Imported from OpenAlex