An edition of Fan-Out Wafer-Level Packaging (2018)

Fan-Out Wafer-Level Packaging

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Cover of: Fan-Out Wafer-Level Packaging by John H. Lau, John H. Lau
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Last edited by ImportBot
February 27, 2022 | History
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An edition of Fan-Out Wafer-Level Packaging (2018)

Fan-Out Wafer-Level Packaging

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Publish Date
Publisher
Springer
Pages
323

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Subjects

Electronic packaging

Showing 3 featured editions. View all 3 editions?

Edition Availability
Cover of: Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
2018, Springer
in Chinese
Libraries near you: WorldCat
Cover of: Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Dec 16, 2018, Springer
paperback
  • Not in Library
Libraries near you: WorldCat
Cover of: Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Apr 13, 2018, Springer
hardcover
Libraries near you: WorldCat

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Book Details

Classifications

Library of Congress
TK7867-7867.5

The Physical Object

Format
paperback
Number of pages
323

ID Numbers

Open Library
OL27943800M
ISBN 10
9811342660
ISBN 13
9789811342660

Source records

amazon.com record
Better World Books record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
February 27, 2022 Edited by ImportBot import existing book
April 22, 2020 Created by ImportBot Imported from amazon.com record