An edition of Foldable flex and thinned silicon multichip packaging technology (2003)

Foldable flex and thinned silicon multichip packaging technology

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Last edited by ImportBot
February 25, 2022 | History
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An edition of Foldable flex and thinned silicon multichip packaging technology (2003)

Foldable flex and thinned silicon multichip packaging technology

by

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
Kluwer Academic Publishers
Language
English
Pages
338

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Subjects
Multichip modules (Microelectronics), Chip scale packaging, Flexible printed circuits, Microelectronic packaging, Electronic packaging, Microelectronics, Printed circuits

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Edition Availability
Cover of: Foldable flex and thinned silicon multichip packaging technology
Foldable flex and thinned silicon multichip packaging technology
2003, Kluwer Academic Publishers
in English
  • Not in Library
Libraries near you: WorldCat

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Book Details

Edition Notes

"A publication by Kluwer for IMAPS (International Microelectronic and Packaging Society)".

Includes bibliographical references and index.

Published in
Boston
Series
Emerging technology in advanced packaging series -- 1.

Classifications

Library of Congress
TK7870.15 .F65 2003, TK7870.15 .F65 2003, TS1-2301

The Physical Object

Pagination
xix, 338 p. :
Number of pages
338

ID Numbers

Open Library
OL18183504M
ISBN 10
0792376765
LCCN
2002034095
Goodreads
5626568

Source records

Oregon Libraries MARC record
Library of Congress MARC record
Library of Congress MARC record
Better World Books record

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History

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February 25, 2022 Edited by ImportBot import existing book
February 6, 2019 Created by MARC Bot import existing book