An edition of Microelectronics packaging handbook
(1997)
Microelectronics Packaging Handbook, Part III
Subsystem Packaging (Microelectronics Packaging Handbook)
by R.R. Tummala, Eugene J. Rymaszewski, and Alan G. Klopfenstein
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Previews available in: English
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| Edition | Availability |
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1
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Microelectronics Packaging Handbook)
January 31, 1997, Springer
in English
0412084414 9780412084416
|
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WorldCat
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2
Microelectronics packaging handbook
1997, Chapman & Hall
in English
- 2nd ed.
0412084317 9780412084317
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3
Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Microelectronics Packaging Handbook)
January 31, 1997, Springer
in English
0412084511 9780412084515
|
aaaa
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WorldCat
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4
Microelectronics Packaging Handbook, Part I: Technology Drivers (Microelectronics Packaging Handbook)
January 15, 1997, Springer
in English
0412084317 9780412084317
|
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Book Details
First Sentence
"Packaged electronics is the embodiment of all electronic equipmentcalculators, personal computers (PCs), mainframe computers, telephones, television, and so forth."
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| December 19, 2023 | Edited by ImportBot | import existing book |
| February 13, 2022 | Edited by ImportBot | import existing book |
| August 4, 2020 | Edited by ImportBot | import existing book |
| April 2, 2019 | Created by MARC Bot | import existing book |