An edition of Flip chip technologies (1996)

Flip chip technologies

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Cover of: Flip chip technologies by John H. Lau, editor.
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Last edited by MARC Bot
July 18, 2024 | History
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An edition of Flip chip technologies (1996)

Flip chip technologies

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  • 0 Ratings
  • 1 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
McGraw-Hill
Language
English
Pages
565

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Subjects
Multichip modules (Microelectronics), Very large scale integration, Flip chip technology, Integrated circuits, Design and construction, Technological innovations, Microelectronic packaging

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Edition Availability
Cover of: Flip chip technologies
Flip chip technologies
1996, McGraw-Hill
in English
  • Not in Library
Libraries near you: WorldCat

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Book Details

Edition Notes

Includes bibliographical references and index.

Published in
Boston, Mass
Series
Electronic packaging and interconnection series

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7874 .F5897 1996, TK7874.F5897 1995, TK7874 .F5897 1995

The Physical Object

Pagination
xxiv, 565 p. :
Number of pages
565

ID Numbers

Open Library
OL807939M
ISBN 10
0070366098
LCCN
95044649
OCLC/WorldCat
33276926
Goodreads
4013220

Source records

Scriblio MARC record
Better World Books record
Library of Congress MARC record
marc_columbia MARC record

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History

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July 18, 2024 Edited by MARC Bot import existing book
August 3, 2020 Edited by ImportBot import existing book
April 3, 2019 Created by MARC Bot import existing book